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Mechanical properties and kinetics of intermetallics growth in four lead-free solder alloys, Sn-3.2Ag-0.8Cu, Sn-3.5Ag, Sn-0.7Cu and Sn-8.9Zn, applied to copper substrates
Madeni, Juan Carlos
Madeni, Juan Carlos
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2002
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Madeni_10794677.pdf
Adobe PDF, 44.76 MB
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