Investigation of time-temperature dependent deformation behavior in low temperature solid state bonding of copper, An

Olson, D. L. (David LeRoy)Nichting, Roger A.2023-05-302023-05-301989https://hdl.handle.net/11124/177077Includes bibliographical references (pages 125-135).doctoral dissertationsengCopyright of the original work is retained by the author.CopperDiffusion bonding (Metals)Investigation of time-temperature dependent deformation behavior in low temperature solid state bonding of copper, AnText