Behavior of thiourea and 1-methyl-2-thiourea in an acid copper plating bath, The

Kennedy, George H.Croy, Robert E.2021-02-092022-02-032021-02-092022-02-031976https://hdl.handle.net/11124/175926Includes bibliographical references.masters thesesengCopyright of the original work is retained by the author.ElectroplatingThioureaCopper sulfateSurface active agentsBehavior of thiourea and 1-methyl-2-thiourea in an acid copper plating bath, TheText