Mechanical properties and kinetics of intermetallics growth in four lead-free solder alloys, Sn-3.2Ag-0.8Cu, Sn-3.5Ag, Sn-0.7Cu and Sn-8.9Zn, applied to copper substrates

Liu, StephenMadeni, Juan Carlos2022-12-082022-12-082002https://hdl.handle.net/11124/15644Includes bibliographical references (pages 132-137).masters thesesengCopyright of the original work is retained by the author.Solder and solderingWelded joints -- MetallographyCopperAlloys -- FatigueCopper alloysIntermetallic compoundsMechanical properties and kinetics of intermetallics growth in four lead-free solder alloys, Sn-3.2Ag-0.8Cu, Sn-3.5Ag, Sn-0.7Cu and Sn-8.9Zn, applied to copper substratesText