Martins, Gerard P.Chen, Wen-Ming2022-08-092022-08-091994https://hdl.handle.net/11124/14727Includes bibliographical references (pages 116-119).masters thesesengCopyright of the original work is retained by the author.CopperCopper oxideAluminum oxideCeramic to metal bonding -- Mathematical modelsSealing (Technology) -- Mathematical modelsTransient-liquid-phase bonding of thin copper discs to sapphire by a cuprous oxide interlayerText