Thermal and mechanical deformation of conductive adhesives using electron-beam moire

Berger, John R.Drexler, E. S.2022-08-172022-08-171996https://hdl.handle.net/11124/14961Includes bibliographical references (pages 104-116).masters thesesengCopyright of the original work is retained by the author.AdhesivesMoiré methodThermal and mechanical deformation of conductive adhesives using electron-beam moireText