Optimization of colloid deposition via dielectrophoretic assembly and flow coating

McKenzie, KellyGong, JingjingWu, Ning2017-08-042022-02-032017-08-042022-02-03https://hdl.handle.net/11124/171269http://dx.doi.org/10.25676/11124/171269postersengCopyright of the original work is retained by the author.Optimization of colloid deposition via dielectrophoretic assembly and flow coatingText