Ambient oxidation dynamics of copper antimicrobial surfaces

Abstract

In recent years, increased resistance of pathogens to traditional antibiotics has mounted serious health concerns. The development of novel, improved, and non-selective antimicrobial agents is necessary to combat the further spread of infectious disease and protect public health from antibiotic resistant superbugs. Recent advancements in understanding naturally biocidal surfaces have led to the development of nanopatterning techniques aimed at enhancing the antimicrobial properties of metallic substrates like copper. Copper possesses natural antimicrobial activity which can be enhanced by creating nanoscale surface features. Leveraging the heightened biocidal effect of copper substrates holds promise across various applications to address the escalating challenges posed by bacterial resistance and the proliferation of infectious diseases. However, despite its efficacy and common use in antimicrobial applications, copper is susceptible to oxidation in ambient environments. To understand how copper surfaces change when used in biocidal applications, surface oxide thickness on four copper substrates was periodically measured using ellipsometry to characterize the growth of cuprous oxide under ambient conditions. Such analysis aims to quantify oxide layer thickness and delineate the growth kinetics of cuprous oxide under ambient conditions, providing crucial insights into the response of copper substrates to ambient environmental factors. Understanding surface oxidation dynamics is pivotal in evaluating the long-term antimicrobial efficacy of copper and optimizing its applications in combating infectious diseases.