Show simple item record

dc.contributor.advisorEdwards, Glen R.
dc.contributor.authorMeier, Alan M.
dc.date.accessioned2022-05-24T20:14:41Z
dc.date.available2022-05-24T20:14:41Z
dc.date.issued1990
dc.identifierT 3848
dc.identifier.urihttp://hdl.handle.net/11124/13225
dc.descriptionIncludes bibliographical references.
dc.format.mediummasters theses
dc.languageEnglish
dc.language.isoeng
dc.publisherColorado School of Mines. Arthur Lakes Library
dc.relation.ispartof1990-1999 - Mines Theses & Dissertations
dc.rightsCopyright of the original work is retained by the author.
dc.subject.lcshDiffusion bonding (Metals)
dc.subject.lcshCathode sputtering (Plating process)
dc.titleLow temperature solid state bonding of copper using sputtered silver interlayers
dc.typeText
thesis.degree.nameMaster of Science (M.S.)
thesis.degree.levelMasters
thesis.degree.disciplineMetallurgical and Materials Engineering
thesis.degree.grantorColorado School of Mines


Files in this item

Thumbnail
Name:
Meier_10783576.pdf
Size:
4.273Mb
Format:
PDF

This item appears in the following Collection(s)

Show simple item record